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sdfs063a ? d2932, march 1987 ? revised october 1993 copyright ? 1993, texas instruments incorporated 2?1 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 ? 3-state outputs drive bus lines or buffer memory address registers ? package options include plastic small-outline (soic) and shrink small-outline (ssop) packages, ceramic chip carriers, and plastic and ceramic dips description these octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. taken together with the f240 and f241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical oe (active-low output-enable) inputs, and complementary oe and oe inputs. the f244 is organized as two 4-bit buffers/line drivers with separate output enable (oe ) inputs. when oe is low, the device passes data from the a inputs to the y outputs. when oe is high, the outputs are in the high-impedance state. the sn74f244 is available in ti?s shrink small-outline package (db), which provides the same i/o pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. the sn54f244 is characterized for operation over the full military temperature range of ? 55 c to 125 c. the sn74f244 is characterized for operation from 0 c to 70 c. function table (each buffer) inputs output oe a output y l h h l ll h x z 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 1oe 1a1 2y4 1a2 2y3 1a3 2y2 1a4 2y1 gnd v cc 2oe 1y1 2a4 1y2 2a3 1y3 2a2 1y4 2a1 sn54f244 ...j p ackage sn74f244 . . . db, dw, or n package (top view) 3 2 1 20 19 9 10 11 12 13 4 5 6 7 8 18 17 16 15 14 1y1 2a4 1y2 2a3 1y3 1a2 2y3 1a3 2y2 1a4 sn54f244 . . . fk package (top view) 2y4 1a1 1oe 1y4 2a2 2oe 2y1 g nd 2a1 v cc
sdfs063a ? d2932, march 1987 ? revised october 1993 2?2 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 logic symbol ? logic diagram (positive logic) 1 2 4 6 8 19 11 13 15 17 3 5 7 9 12 14 16 18 1a1 1a2 1a3 1a4 1y1 2a1 2a2 2a3 2a4 2y1 1y2 1y3 1y4 2y2 2y3 2y4 2oe 1oe 2 1a1 4 1a2 6 1a3 8 1a4 en 1 1y1 18 1y2 16 1y3 14 1y4 12 11 2a1 13 2a2 15 2a3 17 2a4 en 19 2y1 9 2y2 7 2y3 5 2y4 3 1oe 2oe ? this symbol is in accordance with ansi/ieee std 91-1984 and iec publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i (see note 1) ?1.2 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input current range ?30 ma to 5 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . voltage range applied to any output in the disabled or power-off state ?0.5 v to 5.5 v . . . . . . . . . . . . . . . . . . . voltage range applied to any output in the high state ?0.5 v to v cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . current into any output in the low state: sn54f244 96 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . sn74f244 128 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating free-air temperature range: sn54f244 ?55 c to 125 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . sn74f244 0 c to 70 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only an d functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. note 1: the input voltage ratings may be exceeded provided the input current ratings are observed.
sdfs063a ? d2932, march 1987 ? revised october 1993 2?3 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 recommended operating conditions sn54f244 sn74f244 unit min nom max min nom max unit v cc supply voltage 4.5 5 5.5 4.5 5 5.5 v v ih high-level input voltage 2 2 v v il low-level input voltage 0.8 0.8 v i ik input clamp current ?18 ?18 ma i oh high-level output current ?12 ?15 ma i ol low-level output current 48 64 ma t a operating free-air temperature ?55 125 0 70 c electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions sn54f244 sn74f244 unit parameter test conditions min typ ? max min typ ? max unit v ik v cc = 4.5 v, i i = ? 18 ma ?1.2 ?1.2 v i oh = ? 3 ma 2.4 3.3 2.4 3.3 v oh v cc = 4.5 v i oh = ? 12 ma 2 3.2 v v oh v cc = 4.5 v i oh = ? 15 ma 2 3.1 v v cc = 4.75 v, i oh = ? 3 ma 2.7 v ol v cc = 4.5 v i ol = 48 ma 0.38 0.55 v v ol v cc = 4.5 v i ol = 64 ma 0.42 0.55 v i ozh v cc = 5.5 v, v o = 2.7 v 50 50 a i ozl v cc = 5.5 v, v o = 0.5 v ?50 ?50 a i i v cc = 5.5 v, v i = 7 v 0.1 0.1 ma i ih v cc = 5.5 v, v i = 2.7 v 20 20 a i il oe v cc = 5.5 v, v i = 0.5 v ?1 ?1 ma i il any a v cc = 5.5 v, v i = 0.5 v ? 1.6 ? 1.6 ma i os ? v cc = 5.5 v, v o = 0 ?100 ?225 ?100 ?225 ma v cc = 5.5 v, outputs high 40 60 40 60 i cc v cc = 5.5 v, outputs open outputs low 60 90 60 90 ma i cc outputs open outputs disabled 60 90 60 90 ma ? all typical values are at v cc = 5 v, t a = 25 c. ? not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
sdfs063a ? d2932, march 1987 ? revised october 1993 2?4 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 switching characteristics (see note 2) parameter from (input) to (output) v cc = 5 v, c l = 50 pf, r l = 500 ? , t a = 25 c v cc = 4.5 v to 5.5 v, c l = 50 pf, r l = 500 ? , t a = min to max ? unit (input) (output) f244 sn54f244 sn74f244 min typ max min max min max t plh a y 1.7 3.6 5.2 2 6.5 1.7 6.2 ns t phl a y 1.7 3.6 5.2 2 7 1.7 6.5 ns t pzh oe y 1.2 3.9 5.7 2 7 1.2 6.7 ns t pzl oe y 1.2 5 7 2 8.5 1.2 8 ns t phz oe y 1.2 4.1 6 2 7 1.2 7 ns t plz oe y 1.2 4.1 6 2 7.5 1.2 7 ns ? for conditions shown as min or max, use the appropriate value specified under recommended operating conditions. note 2: load circuits and waveforms are shown in section 1.
package option addendum www.ti.com 10-jun-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples 5962-9758601q2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 9758601q2a snj54f 244fk 5962-9758601qra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qr a snj54f244j 5962-9758601qra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qr a snj54f244j 5962-9758601QSA active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qs a snj54f244w 5962-9758601QSA active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qs a snj54f244w jm38510/33203b2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 jm38510/ 33203b2a jm38510/33203b2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 jm38510/ 33203b2a jm38510/33203bra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bra jm38510/33203bra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bra jm38510/33203bsa active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bsa jm38510/33203bsa active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bsa m38510/33203b2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 jm38510/ 33203b2a m38510/33203b2a active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 jm38510/ 33203b2a m38510/33203bra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bra
package option addendum www.ti.com 10-jun-2014 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples m38510/33203bra active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bra m38510/33203bsa active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bsa m38510/33203bsa active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 jm38510/ 33203bsa sn54f244j active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 sn54f244j sn54f244j active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 sn54f244j sn74f244dble obsolete ssop db 20 tbd call ti call ti 0 to 70 sn74f244dble obsolete ssop db 20 tbd call ti call ti 0 to 70 sn74f244dbr active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dbr active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f244 sn74f244n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn74f244n sn74f244n active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn74f244n
package option addendum www.ti.com 10-jun-2014 addendum-page 3 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples sn74f244n3 obsolete pdip n 20 tbd call ti call ti 0 to 70 sn74f244n3 obsolete pdip n 20 tbd call ti call ti 0 to 70 sn74f244ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn74f244n sn74f244ne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn74f244n sn74f244nsle obsolete so ns 20 tbd call ti call ti 0 to 70 sn74f244nsle obsolete so ns 20 tbd call ti call ti 0 to 70 sn74f244nsr active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 74f244 sn74f244nsr active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 74f244 sn74f244nsre4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 74f244 sn74f244nsre4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 74f244 snj54f244fk active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 9758601q2a snj54f 244fk snj54f244fk active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 9758601q2a snj54f 244fk snj54f244j active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qr a snj54f244j snj54f244j active cdip j 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qr a snj54f244j snj54f244w active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qs a snj54f244w snj54f244w active cfp w 20 1 tbd a42 n / a for pkg type -55 to 125 5962-9758601qs a snj54f244w
package option addendum www.ti.com 10-jun-2014 addendum-page 4 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of sn54f244, sn74f244 : ? catalog: sn74f244 ? military: sn54f244
package option addendum www.ti.com 10-jun-2014 addendum-page 5 note: qualified version definitions: ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74f244dbr ssop db 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 q1 sn74f244dwr soic dw 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 q1 sn74f244dwr soic dw 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 q1 sn74f244nsr so ns 20 2000 330.0 24.4 9.0 13.0 2.4 12.0 24.0 q1 package materials information www.ti.com 17-aug-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74f244dbr ssop db 20 2000 367.0 367.0 38.0 sn74f244dwr soic dw 20 2000 367.0 367.0 45.0 sn74f244dwr soic dw 20 2000 367.0 367.0 45.0 sn74f244nsr so ns 20 2000 367.0 367.0 45.0 package materials information www.ti.com 17-aug-2016 pack materials-page 2

www.ti.com package outline c typ 10.63 9.97 2.65 max 18x 1.27 20x 0.51 0.31 2x 11.43 typ 0.33 0.10 0 - 8 0.3 0.1 0.25 gage plane 1.27 0.40 a note 3 13.0 12.6 b 7.6 7.4 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic notes: 1. all linear dimensions are in millimeters. dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.43 mm per side. 5. reference jedec registration ms-013. 1 20 0.25 c a b 11 10 pin 1 id area note 4 seating plane 0.1 c see detail a detail a typical scale 1.200
www.ti.com example board layout (9.3) 0.07 max all around 0.07 min all around 20x (2) 20x (0.6) 18x (1.27) (r ) typ 0.05 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic symm symm land pattern example scale:6x 1 10 11 20 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. metal solder mask opening non solder mask defined solder mask details solder mask opening metal under solder mask solder mask defined
www.ti.com example stencil design (9.3) 18x (1.27) 20x (0.6) 20x (2) 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. symm symm 1 10 11 20 solder paste example based on 0.125 mm thick stencil scale:6x
mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150

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